Lam Research Introduces VECTOR® TEOS 3D to Address Critical Advanced Packaging Challenges in Chipmaking
Summary
Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Pave...
Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures FREMONT, Calif. , Sept. 9, 2025 /PRNewswire/ -- Lam Research Corp. (Nasdaq: LRCX) today unveiled VECTOR® TEOS 3D, a breakthrough deposition tool engineered specifically for the advanced packaging of next-generation chips required for artificial intelligence (AI) and high-performance computing (HPC) applications.