Synopsys Collaborates with TSMC to Drive the Next Wave of AI and Multi-Die Innovation

AI-Driven EDA and Broad IP Solutions Enable Differentiated Designs on TSMC Advanced Processes and SoIC Technologies Key Highlights  Certified digital and analog flows on the TSMC N2P and A16™ processes using TSMC NanoFlex™ architecture boost performance and speed analog design migration 3DIC Compiler platform and 3D-enabled IP enable multiple customer tape outs using advanced 3D stacking and CoWoS packaging technologies AI-optimized photonic flow for TSMC Compact Universal Photonic Engine (TSMC-COUPE™) technology enhances system design performance and addresses multi-wavelength and thermal requirements Industry's broadest IP portfolio, on TSMC N2/N2P, optimized for low power, speeds path to silicon success and reduces integration risk SUNNYVALE, Calif. , Sept. 24, 2025 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) announced today its ongoing close collaboration with TSMC to deliver multi-die solutions, encompassing advanced EDA and IP products, that support TSMC's leading-edge processes and packaging technologies, driving innovation in AI chip and multi-die design.